Conference paper 2022

Assembly Reliability and Failure Mechanism Analysis of CCGA Devices

ZL
Zhang, Leihao
 ZH
Zhang, Hongwei
 ZH
Zhang, Haiming
 WW
Wang, Wenyan
 XA
Xiao, Aibin
 LH
Li, Haiyan
 JL
Ji, Li
 LJ
Liu, Jingyu
2022 IEEE 2nd International Conference on Power, Electronics and Computer Applications, ICPECA 2022
Conference · pp. 1105-1108
Abstract

Assembly reliability of ceramic column grid array (CCGA) devices complex in package has relatively great influence on their application. This paper examines the failure mechanisms of board-level surface mount solder joints of CCGA devices in mechanical test and temperature cycle stress. The result shows that the assembly reliability of CCGA devices is affected by the degree of the coefficient of thermal expansion (CTE) match between solder columns and printed circuit boards (PCB), as well as the coplanarity, uniformity and inner voids of solder columns. © 2022 IEEE.

Keywords

Author Keywords

reliability CCGA Environmental test

Index Keywords

Mechanical Reliability analysis Failure (mechanical) Printed circuit boards Surface mount technology Thermal expansion Array devices Board-level Ceramic column grid array Failure mechanism Mechanism analysis Solder columns Solder joints Temperature cycles Test cycles Environmental testing
Author Affiliations
China Aerospace Components Engineering Center, Beijing, China
Funding & Acknowledgements
No funding information
References 5 References
1 Electronics and Packaging Tn305 94, (2016)
2 Ghaffarian, Reza, CCGA packages for space applications, Microelectronics Reliability, 46, 12, pp. 2006-2024, (2006)
3 NASA Usrp Internship Final Report, (2009)
4 Annual Pan Pacific Microelectronics Symposium Exhibit, (2009)
5 Smta International Conference, (2014)
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