Article Gold Open Access 2022

TVET Skills Gap Analysis in Electrical and Electronic Industry: Perspectives from Academicians and Industry Players

Journal of Technical Education and Training
Journal · Vol. 14 · Issue 1 · pp. 158-177
Abstract

Skills mismatch or skill gap is a long-standing issue whereby the levels and types of the existing skills do not meet the needs of the job market. With no exception, this issue also become one of the challenges that facing by Technical and Vocational Education and Training (TVET). If this issue prolongs, it will lead to graduate unemployment, specifically in TVET. Therefore, this study aims to identify the occupational skills (including both soft and hard skills) that are perceived as important by those in public Higher Education Institutions (HEI) and the electrical and electronic (E&E) industry which represent the manufacturing industry. A total of 58 academicians from public HEI and 55 industry players from the E&E industry in Malaysia were chosen purposively. These academicians and industry players were selected as they are having experience in occupational skill and training in their respective institutions and industries. Questionnaires were distributed online to these targeted respondents. The results revealed that there are skills gaps in terms of both soft and hard skills, which all skills are skills related to the career in E&E industry. The outcomes of this study should enable the Ministry of Higher Education, mainly in TVET to devise strategies to improve graduate employability. They might also serve as additional evidence for the occurrence of skills mismatch. © Universiti Tun Hussein Onn Malaysia Publisher’s Office.

Keywords

Author Keywords

higher education institution electrical and electronic industry occupational skills TVET skills mismatch

Index Keywords

Author Affiliations
Faculty of Technology Management and Business, Universiti Tun Hussein Onn Malaysia, Batu Pahat, Johor, Malaysia
Azman Hashim International Business School, Kuala Lumpur, Malaysia
Funding & Acknowledgements
Universiti Tun Hussein Onn Malaysia, UTHM
The authors wish to thank the Ministry of Higher Education Malaysia for their support for this research under Fundamental Research Grant Scheme Vot No. FRGS/1/2019/SS03/UTHM/03/1, which was partially sponsored by Universiti Tun Hussein Onn Malaysia.
Ministry of Higher Education, Malaysia, MOHE
Grant: FRGS/1/2019/SS03/UTHM/03/1
The authors wish to thank the Ministry of Higher Education Malaysia for their support for this research under Fundamental Research Grant Scheme Vot No. FRGS/1/2019/SS03/UTHM/03/1, which was partially sponsored by Universiti Tun Hussein Onn Malaysia.
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